01Polishing Machine

The second phase of the plant is under construction, covering an area of 22 acres, planning the whole workshop semiconductor grade clean standards, when the plant will be used for semiconductor industry equipment assembly

02Lapping Machine

Mainly used for semiconductor (silicon, silicon carbide, etc.), universal semiconductor (gallium nitride, silicon nitride, aluminum nitride, etc.), optics and 3C industries of hard and brittle materials single-sided high-precision grinding and polishing

03Grinding Machine

Products are exported to China, the United States, Japan, Vietnam, South Korea, Russia and other countries and regions, product delivery capacity can reach 60 units per month, annual output of 720 units.