Four Connected Single-side Polishing Machine

The Four connected single-side polishing machine delivers rapid, ultra-high precision grinding of semiconductor silicon wafers, achieving substrate-grade quality for 6-inch wafers with TTV ≤ 5μm and exceptional surface roughness (Ra).

Four connected single-side polishing machine enables fully automated production – Eliminating human interference for stable quality and high throughput.

Four connected single-side polishing machine integrates OMRON control system – Ensuring superior operational stability.

Four connected single-side polishing machine features PP head pressure control – Dual-zone (inner/outer ring) regulation enhances machining accuracy and enables rapid process adjustments for specification changes.

Four connected single-side polishing machine utilizes SUS410 lower platen – Processed with specialized annealing for high flatness and deformation resistance.

Four connected single-side polishing machine supports Industrial IoT – Enabling systematic control and data-driven management.

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