Products
Single-sided Lapping Machine
The single-sided lapping machine delivers high-precision, high-efficiency single-sided lapping of sapphire wafer materials. This versatile lapping system also processes parallel planar surfaces of hard brittle materials including silicon carbide (SiC), silicon wafers, germanium wafers, lithium niobate, and glass substrates.
Features
Application
The single-sided lapping machine delivers high-precision, high-efficiency single-sided lapping of sapphire wafer materials. This versatile lapping system also processes parallel planar surfaces of hard brittle materials including silicon carbide (SiC), silicon wafers, germanium wafers, lithium niobate, and glass substrates.
Features
Touch-Screen PLC Control
The single-sided lapping machine features a touch-screen interface with PLC control, providing an open graphical operation platform to maximize hardware performance.
Short & Robust Drive System
Engineered with a shortened drive chain for exceptional stability and reliability during operation.
Independent 4-Head Control
Four actively rotating upper lapping heads with electro-proportional pressure control - each head independently adjustable for precision material processing.
Precision Temperature Management
Circulating cooling water systems for both upper and lower lapping plates ensure accurate thermal control.
32-type single-sided lapping machine
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Model number |
SL32-4DU |
|
|
Upper plate sie |
Polish(mm) |
ø 815mm |
|
Copper sole(mm) |
/ |
|
|
PP head siz |
diameter(mm) |
ø 305 |
|
Processing range |
Maximum machining size |
ø 260 |
|
Precision index |
PP head flatness |
≤0.015mm |
|
lower plate end jump |
≤0.02mm |
|
|
Equipment size (L * W * H) |
About 2200mm*1400mm* 2550mm |
|
|
Device weight |
About4300 KG |
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36-type single-sided lapping machine
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Model number |
SL36-4DU |
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Upper plate sie |
Polish (mm) |
φ914 |
|
|
Copper sole(mm) |
φ875 |
||
|
PP head size |
diameter(mm) |
φ360 |
|
|
Processing range |
Maximum machining size |
φ300 |
|
|
Precision index |
PP head flatness |
≤0.015mm |
|
|
lower plate end jump |
≤0.02mm |
||
|
Equipment size (L * W * H) |
About 1912mm*1280mm*2500mm (Length without turning tool) |
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|
Device weight |
About 4800KG |
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50-type single-sided lapping machine
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Model number |
SL50-4DU |
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|
Upper plate sie |
Polish (mm) |
φ1282 |
|
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Copper sole(mm) |
φ1260 |
||
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PP head size |
diameter(mm) |
φ485 |
|
|
Processing range |
Maximum machining size |
φ450 |
|
|
Precision index |
PP head flatness |
≤0.02mm |
|
|
lower plate end jump |
≤0.03mm |
||
|
Equipment size (L * W * H) |
About 2360mm*1760mm*2930mm (Length without turning tool) |
||
|
Device weight |
About 8100KG |
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54-type single-sided lapping machine
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Model number |
SL54-4DU |
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|
Upper plate sie |
Polish (mm) |
φ1370 |
|
|
Copper sole(mm) |
φ1330 |
||
|
PP head size |
diameter(mm) |
φ520 |
|
|
Processing range |
Maximum machining size |
φ490 |
|
|
Precision index |
PP head flatness |
≤0.02mm |
|
|
lower plate end jump |
≤0.03mm |
||
|
Equipment size (L * W * H) |
About 2610mm*1850mm*2940mm (Length without turning tool)water-cooled) |
||
|
Device weight |
About 9000KG |
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59-type single-sided lapping machine
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Model number |
SL59-4DU |
|
|
Upper plate sie |
Polish(mm) |
φ1504 |
|
Copper sole(mm) |
1465 |
|
|
PP head size |
diameter(mm) |
φ576mm |
|
Processing range |
Maximum machining size |
Φ550mm |
|
Precision index |
PP head flatness |
≤0.015mm |
|
lower plate end jump |
≤0.03mm |
|
|
Equipment size (L * W * H) |
About3010mm×2050 mm×2970 mm |
|
|
Device weight |
10000kg |
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