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Single-sided Polishing Machine

Touch-Screen & PLC Control: The single-sided polishing machine features a touch-screen interface and PLC control system, providing users with an open graphical operation platform to fully utilize the hardware performance.

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Features

Application

The single-sided polishing machine is primarily used for single-sided polishing of sapphire wafer materials. It is also suitable for high-precision, high-efficiency single-sided polishing of parallel planes on other hard and brittle materials such as silicon carbide (SiC), silicon wafers, germanium wafers, lithium niobate, and glass.

Features

Short & Stable Drive Train: The main drive system of the single-sided polishing machine boasts a short transmission chain, ensuring exceptional stability and reliability.

Independent 4-Head Control: Four independent upper polishing heads rotate actively. Pressure is precisely controlled and freely adjustable via electro-proportional valves, with each head individually controllable.

Precise Temperature Control: Both the upper and lower polishing plates of the single-sided polishing machine utilize circulating cooling water for forced cooling, enabling accurate temperature management.

1.32-type single-sided polishing machine

SP32-4DU-1

Model number		SP32-4DU
Upper plate sie	Polish(mm)	ø 815mm
Upper plate sie	Copper sole(mm)	/
PP head siz	diameter(mm)	ø 305
Processing range	Maximum machining size	ø 260
Precision index	PP head flatness	≤0.015mm
Precision index	lower plate end jump	≤0.02mm
Equipment size (L * W * H)		About 2200mm1400mm 2550mm
Device weight		About4300 KG

2.36-type single-sided polishing machine

SP36-4DU

Model number		SP36-4DU	SP36-4DU-M
Upper plate sie	Polish (mm)	φ914	φ974
	Copper sole(mm)	φ875	/
PP head size	diameter(mm)	φ360
Processing range	Maximum machining size	φ300
Precision index	PP head flatness	≤0.015mm
	lower plate end jump	≤0.02mm
Equipment size (L * W * H)		About 1912mm1280mm2500mm (Length without turning tool)	About 2250mm1420mm2700mm
Device weight		About 4800KG

3.50-type single-sided polishing machine

Model number		SP50-4DU	SP50-4DU-M
Upper plate sie	Polish (mm)	φ1282	01342
	Copper sole(mm)	φ1260	/
PP head size	diameter(mm)	φ485
Processing range	Maximum machining size	φ450
Precision index	PP head flatness	≤0.02mm
	lower plate end jump	≤0.03mm
Equipment size (L * W * H)		About 2360mm1760mm2930mm (Length without turning tool)	About 2560mm1820mm3050mm
Device weight		About 8100KG

4.54-type single-sided polishing machine

SP54-4DU

Model number		SP54-4DU	SP54-4DU-M
Upper plate sie	Polish (mm)	φ1370	φ1430
	Copper sole(mm)	φ1330	/
PP head size	diameter(mm)	φ520
Processing range	Maximum machining size	φ490
Precision index	PP head flatness	≤0.02mm
	lower plate end jump	≤0.03mm
Equipment size (L * W * H)		About 2610mm1850mm2940mm (Length without turning tool)water-cooled)	About 2670mm1910mm3050mm (water-cooled)
Device weight		About 9000KG

5.59-type single-sided polishing machine

SP59-4DU

Model number		SP59-4DU	SP59-4DU-M
Upper plate sie	Polish(mm)	φ1504	φ1564
	Copper sole(mm)	1465	/
PP head size	diameter(mm)	φ576mm
Processing range	Maximum machining size	Φ550mm
Precision index	PP head flatness	≤0.015mm
	lower plate end jump	≤0.03mm
Equipment size (L * W * H)		About3010mm×2050 mm×2970 mm	About3010mm×2050 mm×2970 mm
Device weight		10000kg		11000kg

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