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Standard Double-side Lapping Machine

The standard double-side lapping machine processes hard brittle materials – including semiconductor silicon wafers, ceramics, and computer bracket components – through precision double-sided lapping.

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Features

Application

The standard double-side lapping machine processes hard brittle materials – including semiconductor silicon wafers, ceramics, and computer bracket components – through precision double-sided lapping. It also handles double-sided polishing for non-metallic hard brittle materials such as mobile device cover glass, computer touchscreens, and optical glass.

15BD double-sided lapping machine

15BD-2M6L

Model number		15BD-2M6L
Upper and lower plate dimensions	Grinding ( mm )	1041×0395×t50
Upper and lower plate dimensions	Polishing(mm)	1041×0395×t50
Cruising wheel Parameter	module	DP12
	Teeth number	162
	Number	6
Processing range	Maximum machining size	φ300mm
Processing range	Minimum machining thickness	0.25mm
Precision index	Flatness of upper and lower plates	≤0.02mm
Precision index	Lower plate end jump	≤0.03mm
Equipment size (L * W * H)		About 1400mm1800mm2880mm
Device weight		About 4500KG

16BDdouble-sided lapping machine

16BD-3M5L

Model number		16BD -3M5L
Upper and lower plate dimensions	Grinding ( mm )	1145×0379×t50
Upper and lower plate dimensions	Polishing(mm)	01157×0367×t50
Cruising wheel Parameter	module	DP12
	Teeth number	200
	Number	5
Processing range	Maximum machining size	φ380mm
Processing range	Minimum machining thickness	0.20mm
Precision index	Flatness of upper and lower plates	≤0.03mm
Precision index	Lower plate end jump	≤0.04mm
Equipment size (L * W * H)		About 1500mm2000mm2700mm
Device weight		About 5300KG

16SF double-sided lapping machine

16SF-2M5L

Model number		16SF-2M5L
Upper and lower plate dimensions	Grinding ( mm )	01118×0385×t50
Upper and lower plate dimensions	Polishing(mm)	01155×0348×t50
Cruising wheel Parameter	module	DP12
	Teeth number	200
	Number	5
Processing range	Maximum machining size	0380mm
Processing range	Minimum machining thickness	0.20mm
Precision index	Flatness of upper and lower plates	≤0.03mm
Precision index	Lower plate end jump	≤0.06mm
Equipment size (L * W * H)		About1550mm2000mm2740mm
Device weight		About 5500KG

18BD double-sided lapping machine

18BD-3M5L

Model number		18BD-3M5L
Upper and lower plate dimensions	Grinding ( mm )	φ1246×0410×50
Upper and lower plate dimensions	Polishing(mm)	φ1256×0400×50
Cruising wheel Parameter	module	Pitch of pin teeth 18.85
	Teeth number	77
	Number	5
Processing range	Maximum machining size	φ400mm
Processing range	Minimum machining thickness	0.20mm
Precision index	Flatness of upper and lower plates	≤0.03mm
Precision index	Lower plate end jump	≤0.05mm
Equipment size (L * W * H)		About 1580mm2010mm2700mm
Device weight		About 5700KG

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