Automatic Two-axis Air Float Grinder

The automatic two-axis air float grinder is engineered for wafer manufacturers requiring precision backside thinning of silicon carbide (SiC) wafers/ingots, silicon, LED chips, LiTaO₃ crystals, GaAs, integrated circuits (ICs), and discrete devices. This advanced system also delivers precision thinning of germanium, quartz, ceramics, and other hard brittle materials. Configured for large-scale production, the automatic two-axis air float grinder accommodates wafers up to 12" in diameter and enables direct grinding on etched or polished surfaces using fine-grit wheels – effectively minimizing wafer-to-wafer thickness deviation while enhancing intra-wafer Total Thickness Variation (TTV) and flatness uniformity.

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