Products
Automanual Single-axis Mechanical Grinder
The automanual single-axis mechanical grinder delivers precision thinning of hard brittle materials including sapphire, silicon, germanium, quartz, GaAs, ceramics, and SiC.
Features
Application
The automanual single-axis mechanical grinder delivers precision thinning of hard brittle materials including sapphire, silicon, germanium, quartz, GaAs, ceramics, and SiC. This versatile equipment also performs backside thinning for integrated circuits (ICs), discrete devices, and LED chips. Utilizing fine-grit grinding wheels, the automanual single-axis mechanical grinder enables direct processing on etched or polished surfaces – effectively reducing wafer-to-wafer thickness deviation while improving Total Thickness Variation (TTV) within individual wafers.
SFG380-M-S automanual single-axis mechanical grinder
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Model number |
SFG380-M-S single-spindle single-side thinning machine |
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Wafer diameter |
Max 12 |
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spindle |
Spindle type |
High frequency motor built-in mechanical spindle |
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Spindle number |
1 |
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Rated power |
7KW |
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Speed |
0-4000rpm |
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Minimum z-axis movement |
0.1μm |
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Z-axis resolution |
0.1μm |
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Measuring instrument |
Measuring range |
0-1200μm |
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Resolution |
0.1μm |
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repeatability |
±0.5μm |
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Bearing table |
Bearing table spindle type |
Mechanical spindle |
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Bearing table type |
φ360mm ceramic plate |
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Fixed mode |
Vacuum fixation |
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Speed |
0-400rpm |
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Bearing table number |
1 |
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Equipment size (L * W * H) |
About 2026mm*800mm*1915mm |
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Device weight |
About 2500KG |
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