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Automatic Mechanical Chemical Polishing Machine

Automatic Mechanical Chemical Polishing Machine

The Automatic mechanical chemical polishing machine performs single-sided chemical mechanical polishing (CMP) on hard brittle materials including sub-8-inch Si CMP, oxide CMP (BPSG, TEOS, ThOx), metal CMP (W, Cu), dielectric films, and STI (shallow trench isolation) applications.

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Features

Application

 

The Automatic mechanical chemical polishing machine performs single-sided chemical mechanical polishing (CMP) on hard brittle materials including sub-8-inch Si CMP, oxide CMP (BPSG, TEOS, ThOx), metal CMP (W, Cu), dielectric films, and STI (shallow trench isolation) applications. This fully automated CMP system also delivers high-precision, high-efficiency single-sided polishing for parallel planar surfaces of sapphire wafers, germanium wafers, lithium niobate, and glass substrates.

 

Automatic mechanical chemical polishing machine

 

SAP200-4H2P-FA

Model number

SAP200-4H2P-FA

polishing disk

Diameter

Φ510mm(20'')

Number

2

Lower disc speed

0-200rpm

polishing head

Processing workpieces

6''/8''

Pressurization method

Airbag flexible pressure back pressure function (3-zone pressure)

speed

0-200rpm

Number

4

Precision index

The lower end jumps

≤0.01mm

Flatness of the lower plate

≤0.008mm

Equipment size (L * W * H)

3640mm×2400 mm×2600 mm

Device weight

10000KG

 

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