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Edge Polishing Machine

The edge polishing machine delivers high-efficiency processing of wafer edges for semiconductor materials including silicon carbide (SiC), silicon, and sapphire. This specialized machine precisely polishes critical wafer features: V-notches, FG-A surfaces, TOP surfaces, and CF-B surfaces to micron-level specifications.

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Features

Application

WEP150 edge polishing machine

WEP150

Model number		WEP150
Processing range	Workpiece specification	6 ″,8 ″
Processing efficiency		3min / pcs
The volume of the liquid supply bucket		50L
Total power of the equipment	Power	5.5 kW
Equipment size (L * W * H)		2650mm1450mm2200mm
Device weight		about 3000 KG

WEP200edge polishing machine

WEP200

Model number		WEP200
Processing range	Workpiece specification	8 ″
Processing efficiency		3min/pcs
The volume of the liquid supply bucket		60L
Total power of the equipment	Power	10 kW
Equipment size (L * W * H)		3000mm1600mm2550mm
Device weight		4000Kg

WEP300edge polishing machine

Model number		WEP300
Processing range	Workpiece specification	12"
Processing efficiency		3min/pcs
The volume of the liquid supply bucket		60L
Total power of the equipment	Power	7kW
Equipment size (L * W * H)		2100mm2600mm2550mm
Device weight		3500kg

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